Product Line(s): CHO-BOND®
Product #: 50-01-1030-0000-55 (1lb kit) 50-02-1030-0000-55 (4oz kit) *See ordering information for size options and further description on part numbers.
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CHO-BOND 1030: CHO-BOND 1030 is a silver plated copper filled, one-component conductive silicone designed for applications where a flexible, strong, conductive electrical bond must be achieved. CHO-BOND 1030 greatly simplifies the problem of bonding conductive silicone EMI gaskets to metal substrates. It is formulated for relatively small bond lines (less than 0.010 inches (0.25mm)), and should not be used as an EMI caulk where bond lines are greater than 0.10 inches (0.25 mm). No volatile organic compounds (VOCs) and minimal shrinkage upon curing make CHO-BOND 1030 a good choice for a variety of commercial and military applications. CHOBOND 1030’s moisture cure silicone polymer system allows it to cure to the touch in 24hrs and provides a robust conductive bond over a wide range of application temperatures. For best adhesion results, CHO-BOND 1030 should be used in conjunction with 1086 primer. Typical applications include bonding, repair, and attachment of EMI gaskets, and sealing around EMI vents, windows and electronic enclosures.
Features and Benefits:
- One Component
- Easy to use, no weighing or mixing required
- Silver Plated Copper Fill, good conductivity 0.050 ohm-cm.
- No VOCs
- Minimal Shrinkage.
- Moisture Cure Silicone
- Non corrosive cure mechanism
- Medium paste
- Can be used on overhead or vertical surface
50-01-1030-0000 10 oz kit, comes with 1086 primer, typically in stock
50-02-1030-0000 4 oz kit, comes with 1086 primer, nozzle and key, typically in stock