CHO-BOND 1038

CHO-BOND 1038

CHO-BOND 1038 is a one-component, silver-plated copper-filled silicone sealant formulated to serve as a gap-filler for EMI shielding and electrical grounding.

The 6 oz (454 gram) SEMCO cartridge can be dispensed using the SEMCO 250-A pneumatic gun. Additional information regarding dispensing can be found here.

CHO-BOND 1038 is typically in stock or readily available for shipment.

Call 978-777-3837 for more information regarding this product.

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Part Number: 50-XX-1038-0000-55 Category:

Additional Information

  • CHO-BOND 1038 is designed for use as a fillet, gap filler, and seam sealant on electrical enclosures for EMI shielding or electrical grounding.
  • CHO-BOND 1038 may be used for EMI gasket repair, bonding, and attachment in applications where moderate strength (less than 150 psi) is required.
  • CHO-BOND 1038’s moisture-cure silicone polymer system allows it to cure to the touch in 24 hours and provides a robust conductive and environmental seal over a wide range of application temperatures.
  • If your application requires zero volatile organic compounds (VOCs) please see CHO-BOND 1121, which is a solvent-free version of CHO-BOND 1038.
  • Typical applications include man-portable electronics, radar and communication systems, EMI vents, military ground vehicles, and shelters.

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