- CHO-BOND 1035 is designed for use as a fillet, gap filler and seam sealant for electrical enclosures where EMI shielding or electrical grounding is required.
- The lightweight silver-glass filler of CHO-BOND 1035 provides a low-cost EMI shielding solution for a variety of commercial and military applications including applications where weight savings are critical. CHO-BOND 1035 is not recommended for applications where the material will experience vibration.
- CHO-BOND 1035’s moisture cure system allows it to cure to the touch in 24 hours and provides a flexible, conductive, and environmental seal over a wide range of application temperatures.
- Typical applications include man-portable electronics, radar and communication systems, EMI vents, military ground vehicles, and shelters.